Get 20M+ Full-Text Papers For Less Than $1.50/day. Start a 14-Day Trial for You or Your Team.

Learn More →

DeepDyve requires Javascript to function. Please enable Javascript on your browser to continue.

Introduction to Printed Electronics

Part of the SpringerBriefs in Electrical and Computer Engineering Book Series (volume 74)

DOI: 10.1007/978-1-4614-9625-0

ISBN: 978-1-4614-9624-3

Publisher: Springer New York - Springer Journals

Dec 20, 2013

Available

Introduction

Suganuma, Katsuaki

Pages: 1 –22

[Printed electronics (PE) has emerged as one of the key technologies not only for electronics but also for all kinds of electrically controlled machines and equipment. PE is a technology that merges electronics manufacturing and text/graphic printing. By this combination, one can manufacture...
Available

Printing Technology

Suganuma, Katsuaki

Pages: 23 –48

[A wide range of printing methods have already been applied to conventional electronics fabrication. They include screen printing, inkjet printing, gravure printing, flexo printing, and offset printing. They are also applicable to many advanced PE products. Depending on the nature of the PE...
Available

Conducting Materials for Printed Electronics

Suganuma, Katsuaki

Pages: 49 –74

[Wiring is one of the essential technologies not only for PE but for all kinds of electronic products. There are several types of electric conducting materials for PE technology. They include metallic materials such as Ag, Cu, and Au, organic molecules such as PEDOT/PSS (poly...
Available

Semiconductor Materials

Suganuma, Katsuaki

Pages: 75 –85

[Si, having a diamond crystalline structure, is an indispensable semiconductor and has been a major player as a solid-state semiconductor for electronics since 1950s. For PE technology, however, Si semiconductors should be replaced by new materials that can be formulated into inks or modified...
Available

Substrate and Barrier Film

Suganuma, Katsuaki

Pages: 87 –94

[Printed electronics also requires advanced materials technology for substrates. The requirements include flexibility, excellent transparency in many cases, surface smoothness, thin and light weight, low thermal expansion, stiffness, heat resistance, low cost, and others. Several choices are...
Available

Interconnection

Suganuma, Katsuaki

Pages: 95 –117

[In electronics manufacturing, an electric interconnection or a system integration step is always required before releasing products. All expected PE products introduced in Chap. 1 require certain kinds of system integration. For instance, displays fabricated using PE technology always require...
Available

Next Step

Suganuma, Katsuaki

Pages: 119 –124

[This book focused on the key technologies of PE, including expectations for the future. Development is under way, but it is very fast as seen in the revolution of organic or oxide semiconductors even though the technology has just begun. It is true that this field is growing with the revolution...

results per page

Prev
1
Next

Browse All eBooks