1 - 6 of 6 Chapters
[Packaging for MEMS (microelectromechanical systems) is attracting increased interest because it is being recognized as an essential technique for successful commercialization of MEMS product. Similar to integrated circuit (IC) packaging in microelectronics, packaging of MEMS bears the highest...
[As explained in the previous section, transfer packaging is one of interesting MEMS packaging technologies because it doesn’t have process compatibility issues with main MEMS process. Thus, the different transfer techniques will be thoroughly explained in the following]
[This chapter will describe polymer cap transfer packaging techniques based on Si carrier substrate with anti-adhesion coating to achieve post-it-like debonding. The anti-adhesion coating, principally implemented by SAM (Self-Aligned Monolayer), is different from the thin-film coating explained...
[Thin film packaging caps are generally fabricated through sacrificial etch via access holes after deposition of the material over MEMS devices as depicted in Chap. 1. Access hole sacrificial etching would be a barrier for the thin film encapsulation to realize high throughput packaging...
[As already demonstrated previously, the critical step of the transfer packaging is debonding of the temporary carrier substrate. Mechanical modeling is one of solution for such critical step to understand the exact mechanism governing the failure mode of the transfer packaging. Therefore, this...
[Interface energy control technique of transfer cap packaging can be useful for other applications which require a temporary carrier or support to implement suspended structure or flexible substrate etc. This chapter describes a few examples of fabrication methods and devices which utilize the...
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