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Assessment of ultra-thin Si wafer thickness in 3D wafer stacking

Assessment of ultra-thin Si wafer thickness in 3D wafer stacking http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Microelectronics Reliability CrossRef

Assessment of ultra-thin Si wafer thickness in 3D wafer stacking

Microelectronics Reliability , Volume 50 (2): 195-198 – Feb 1, 2010

Assessment of ultra-thin Si wafer thickness in 3D wafer stacking

Microelectronics Reliability , Volume 50 (2): 195-198 – Feb 1, 2010

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Publisher
CrossRef
ISSN
0026-2714
DOI
10.1016/j.microrel.2009.10.002
Publisher site
See Article on Publisher Site

Abstract

Journal

Microelectronics ReliabilityCrossRef

Published: Feb 1, 2010

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