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A study on the diamond grinding of ultra-thin silicon wafers

A study on the diamond grinding of ultra-thin silicon wafers The demand for ultra-thin silicon wafers has escalated in recent years with the rapid development of miniaturized electronic devices. In this work, diamond grinding for thinning silicon wafers was carried out on an ultra-precision grinding machine. The thinning performance and the minimum wafer thickness were investigated under different grinding conditions. It was found that the grain depth of cut that was used to characterize the overall grinding conditions played an important role in the determination of the final grinding performance. The relationship between the subsurface damage of the ground wafer and the minimum wafer thickness achieved was also revealed. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture SAGE

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References (27)

Publisher
SAGE
Copyright
© IMechE 2012
ISSN
0954-4054
eISSN
2041-2975
DOI
10.1177/0954405411414768
Publisher site
See Article on Publisher Site

Abstract

The demand for ultra-thin silicon wafers has escalated in recent years with the rapid development of miniaturized electronic devices. In this work, diamond grinding for thinning silicon wafers was carried out on an ultra-precision grinding machine. The thinning performance and the minimum wafer thickness were investigated under different grinding conditions. It was found that the grain depth of cut that was used to characterize the overall grinding conditions played an important role in the determination of the final grinding performance. The relationship between the subsurface damage of the ground wafer and the minimum wafer thickness achieved was also revealed.

Journal

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering ManufactureSAGE

Published: Jan 1, 2012

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