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The mechanism of material removal in ultrasonic drilling of engineering ceramics

The mechanism of material removal in ultrasonic drilling of engineering ceramics AbstractA new method for drilling holes in engineering ceramics by using a rotary ultrasonic tool has been developed. In this method, a drilling tool impregnated with abrasive particles is simultaneously rotated and vibrated. The mechanism of ultrasonic drilling is analysed using the concept of fracture mechanics and a new theoretical model of material removal rate (MRR) is proposed. According to this model, the material removal rate increases with increases of applied static load, amplitude of vibration and rotation speed of the drilling tool. Test results show that ultrasonic drilling is an effective method for machining engineering ceramics. http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture SAGE

The mechanism of material removal in ultrasonic drilling of engineering ceramics

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References (10)

Publisher
SAGE
Copyright
© 2000 Institution of Mechanical Engineers
ISSN
0954-4054
eISSN
2041-2975
DOI
10.1243/0954405001517874
Publisher site
See Article on Publisher Site

Abstract

AbstractA new method for drilling holes in engineering ceramics by using a rotary ultrasonic tool has been developed. In this method, a drilling tool impregnated with abrasive particles is simultaneously rotated and vibrated. The mechanism of ultrasonic drilling is analysed using the concept of fracture mechanics and a new theoretical model of material removal rate (MRR) is proposed. According to this model, the material removal rate increases with increases of applied static load, amplitude of vibration and rotation speed of the drilling tool. Test results show that ultrasonic drilling is an effective method for machining engineering ceramics.

Journal

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering ManufactureSAGE

Published: Sep 1, 2000

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