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Designing TSVs for 3D Integrated CircuitsConclusions and Future Directions

Designing TSVs for 3D Integrated Circuits: Conclusions and Future Directions [This book investigates challenges associated with TSVs in 3-D ICs. This work is innovative as it explores design and technology challenges, evaluates potential benefits, and proposes novel solutions. The results presented in this book advance the understanding of TSV-based 3-D IC design and guide designers in selecting design and technology parameters.] http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png

Designing TSVs for 3D Integrated CircuitsConclusions and Future Directions

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Publisher
Springer New York
Copyright
© The Authors 2013
ISBN
978-1-4614-5507-3
Pages
63 –65
DOI
10.1007/978-1-4614-5508-0_7
Publisher site
See Chapter on Publisher Site

Abstract

[This book investigates challenges associated with TSVs in 3-D ICs. This work is innovative as it explores design and technology challenges, evaluates potential benefits, and proposes novel solutions. The results presented in this book advance the understanding of TSV-based 3-D IC design and guide designers in selecting design and technology parameters.]

Published: Aug 27, 2012

Keywords: Power Delivery; Substrate Noise; Book Advance; Device Blockage; Select Design

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