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Introduction to Printed ElectronicsSubstrate and Barrier Film

Introduction to Printed Electronics: Substrate and Barrier Film [Printed electronics also requires advanced materials technology for substrates. The requirements include flexibility, excellent transparency in many cases, surface smoothness, thin and light weight, low thermal expansion, stiffness, heat resistance, low cost, and others. Several choices are available as substrates depending on the nature of the PE product. Of course, it is possible not to make any choice of substrate but direct printing on the cases with a 3D printing technology. But using certain flexible substrates will be the major for mass production and ultimately will be applied to a roll-to-roll process.Table 5.1 lists materials commonly used in PE products.] http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png

Introduction to Printed ElectronicsSubstrate and Barrier Film

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Publisher
Springer New York
Copyright
© Springer Science+Business Media New York 2014
ISBN
978-1-4614-9624-3
Pages
87 –94
DOI
10.1007/978-1-4614-9625-0_5
Publisher site
See Chapter on Publisher Site

Abstract

[Printed electronics also requires advanced materials technology for substrates. The requirements include flexibility, excellent transparency in many cases, surface smoothness, thin and light weight, low thermal expansion, stiffness, heat resistance, low cost, and others. Several choices are available as substrates depending on the nature of the PE product. Of course, it is possible not to make any choice of substrate but direct printing on the cases with a 3D printing technology. But using certain flexible substrates will be the major for mass production and ultimately will be applied to a roll-to-roll process.Table 5.1 lists materials commonly used in PE products.]

Published: Dec 20, 2013

Keywords: Paper Substrate; Barrier Film; Organic Device; Organic Electronic Device; Direct Printing

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