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Masthead: (Adv. Mater. Interfaces 16/2023)

Masthead: (Adv. Mater. Interfaces 16/2023) www.ami-journal.de Editor-in-Chief: Jolke Perelaer Executive Board: Hans M. Christen, Oak Ridge National Bartosz A. Grzybowski, Ulsan Deputy Editors: Gaia Tomasello Laboratory, TN National Institute of Science and Editors: James Cook Harald Fuchs, University of Münster Technology Alanna Gannon Karen K. Gleason, Massachusetts Institute of Lei Jiang, Chinese Academy of Sciences, Beijing Brenton Hammer Technology, Cambridge, MA Alexander Shluger, University College London Tianyu Liu Matt Lock Lisa Smith Administration: Ruoxuan Guo Sander C. G. Leeuwenburgh, Radboud Advisory Board: Alexandra Universiteit Nijmegen Charles Ahn, Yale University, New Haven, Harris Gunn Marina S. Leite, University of California, CT Davis, CA Production: Katja Kornmacher Ariando, National University of Singapore Pavel Levkin, Karlsruher Institut für Technolo- Derya Baran, King Abdullah University of Marketing: Melanie Baumann gie, Eggenstein-Leopoldshafen Science and Technology, Thuwal Editorial Office: Oliver Lieleg, Technical University of Munich, Ilker S. Beyer, Instituto Italiano Di Tecnologia, Garching advmatinterfaces@wiley.com Genoa Maria Antonietta Loi, Rijksuniversiteit Robert W. Carpick, University of Pennsylvania, advmatinterfaces@wiley-vch.de Groningen Philadelphia, PA Manuscript Submission: Chiara Neto, The University of Sydney Lifeng Chi, Soochow University, Suzhou https://www.editorialmanager.com/advmatinterfaces Gianfranco Pacchioni, Università degli Studi Paul K. Chu, City University of Hong Kong, Milano-Bicocca, Milano Kowloon Jeong Young Park, Korea Advanced Institute Anjana Devi, Ruhr-Universität Bochum of Science and Technology, Daejeon Georg Duesberg, Universität der Bundeswehr Hailin Peng, Peking University, Beijing München, Neubiberg Mikko Ritala, University of Helsinki Disclaimer: The Publisher and Editors cannot be held Mats Fahlman, Linköpings Universitet responsible for errors or any consequences arising from Jennifer Rupp, Technical University of Munich, Hongjin Fan, Nanyang Technological the use of information contained in this journal; the views Garching and opinions expressed do not necessarily reflect those University, Singapore of the Publisher and Editors, neither does the publication Yukihiro Shimogaki, University of Tokyo Jinlong Gong, Tianjin University of advertisements constitute any endorsement by the Dan Wang, Chinese Academy of Sciences, Michael Hitchman, University of Strathclyde, Publisher and Editors of the products advertised. Beijing Glasgow Wiley Open Access articles posted to repositories or Christof Wöll, Karlsruher Institut für Technologie, websites are without warranty from Wiley of any kind, Gary Hodes, Weizmann Institute, Rehovot either express or implied, including, but not limited to, Eggenstein-Leopoldshafen René A. J. Janssen, Technische Universiteit warranties of merchantability, fitness for a particular Kai Wu, Peking University, Beijing Eindhoven purpose, or noninfringement. To the fullest extent Yan Yu, University of Science and Technology of permitted by law Wiley disclaims all liability for any loss or Antoine Kahn, Princeton University, NJ damage arising out of, or in connection, with the use of or China, Hefei Maarit Karppinen, Aalto University, Helsinki inability to use the content. Qiang Zhang, Tsinghua University, Beijing David Kisailus, University of California, Irvine, For submission instructions, subscription, and all the Nanfeng Zheng, Xiamen University CA latest information, visit http://www.ami-journal.de Han Zuilhof, Wageningen University & Mato Knez, CIC nanoGUNE, Donostia–San ISSN 2196-7350 Research Sebastián 2023 Wiley-VCH GmbH The image featured on the Advanced Materials Interfaces masthead was provided by R. Klupp-Taylor and co-workers, based on their original cover image, featured on Advanced Materials, Volume 23, Issue 22-23. admi202370054_Masthead_eonly.indd 1 17/05/23 10:34 AM http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.png Advanced Materials Interfaces Wiley

Masthead: (Adv. Mater. Interfaces 16/2023)

Advanced Materials Interfaces , Volume 10 (16) – Jun 1, 2023
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Publisher
Wiley
Copyright
© 2023 Wiley‐VCH GmbH
eISSN
2196-7350
DOI
10.1002/admi.202370054
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Abstract

www.ami-journal.de Editor-in-Chief: Jolke Perelaer Executive Board: Hans M. Christen, Oak Ridge National Bartosz A. Grzybowski, Ulsan Deputy Editors: Gaia Tomasello Laboratory, TN National Institute of Science and Editors: James Cook Harald Fuchs, University of Münster Technology Alanna Gannon Karen K. Gleason, Massachusetts Institute of Lei Jiang, Chinese Academy of Sciences, Beijing Brenton Hammer Technology, Cambridge, MA Alexander Shluger, University College London Tianyu Liu Matt Lock Lisa Smith Administration: Ruoxuan Guo Sander C. G. Leeuwenburgh, Radboud Advisory Board: Alexandra Universiteit Nijmegen Charles Ahn, Yale University, New Haven, Harris Gunn Marina S. Leite, University of California, CT Davis, CA Production: Katja Kornmacher Ariando, National University of Singapore Pavel Levkin, Karlsruher Institut für Technolo- Derya Baran, King Abdullah University of Marketing: Melanie Baumann gie, Eggenstein-Leopoldshafen Science and Technology, Thuwal Editorial Office: Oliver Lieleg, Technical University of Munich, Ilker S. Beyer, Instituto Italiano Di Tecnologia, Garching advmatinterfaces@wiley.com Genoa Maria Antonietta Loi, Rijksuniversiteit Robert W. Carpick, University of Pennsylvania, advmatinterfaces@wiley-vch.de Groningen Philadelphia, PA Manuscript Submission: Chiara Neto, The University of Sydney Lifeng Chi, Soochow University, Suzhou https://www.editorialmanager.com/advmatinterfaces Gianfranco Pacchioni, Università degli Studi Paul K. Chu, City University of Hong Kong, Milano-Bicocca, Milano Kowloon Jeong Young Park, Korea Advanced Institute Anjana Devi, Ruhr-Universität Bochum of Science and Technology, Daejeon Georg Duesberg, Universität der Bundeswehr Hailin Peng, Peking University, Beijing München, Neubiberg Mikko Ritala, University of Helsinki Disclaimer: The Publisher and Editors cannot be held Mats Fahlman, Linköpings Universitet responsible for errors or any consequences arising from Jennifer Rupp, Technical University of Munich, Hongjin Fan, Nanyang Technological the use of information contained in this journal; the views Garching and opinions expressed do not necessarily reflect those University, Singapore of the Publisher and Editors, neither does the publication Yukihiro Shimogaki, University of Tokyo Jinlong Gong, Tianjin University of advertisements constitute any endorsement by the Dan Wang, Chinese Academy of Sciences, Michael Hitchman, University of Strathclyde, Publisher and Editors of the products advertised. Beijing Glasgow Wiley Open Access articles posted to repositories or Christof Wöll, Karlsruher Institut für Technologie, websites are without warranty from Wiley of any kind, Gary Hodes, Weizmann Institute, Rehovot either express or implied, including, but not limited to, Eggenstein-Leopoldshafen René A. J. Janssen, Technische Universiteit warranties of merchantability, fitness for a particular Kai Wu, Peking University, Beijing Eindhoven purpose, or noninfringement. To the fullest extent Yan Yu, University of Science and Technology of permitted by law Wiley disclaims all liability for any loss or Antoine Kahn, Princeton University, NJ damage arising out of, or in connection, with the use of or China, Hefei Maarit Karppinen, Aalto University, Helsinki inability to use the content. Qiang Zhang, Tsinghua University, Beijing David Kisailus, University of California, Irvine, For submission instructions, subscription, and all the Nanfeng Zheng, Xiamen University CA latest information, visit http://www.ami-journal.de Han Zuilhof, Wageningen University & Mato Knez, CIC nanoGUNE, Donostia–San ISSN 2196-7350 Research Sebastián 2023 Wiley-VCH GmbH The image featured on the Advanced Materials Interfaces masthead was provided by R. Klupp-Taylor and co-workers, based on their original cover image, featured on Advanced Materials, Volume 23, Issue 22-23. admi202370054_Masthead_eonly.indd 1 17/05/23 10:34 AM

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Advanced Materials Interfaces – Wiley

Published: Jun 1, 2023

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